CALL FOR PAPERS
Material Physics: Physical Properties of Materials Material thermodynamics Material preparation technology Materials engineering atomic physics quantum mechanics Solid State Physics mechanical properties of materials Optoelectronic materials Microelectronics materials semiconductor superconductor Nanomaterials and Nanotechnology nanofabrication Material processing Engineering structure: Structural Wind Engineering structural monitoring Structural seismic resistance, vibration reduction, and vibration control Reliability and durability of the structure Structural load-bearing capacity Mechanical properties of engineering structures and materials Structural deformation and failure
Submission Portal
If you have any questions or need any help about the conference, please feel free to contact our conference experts on the right:

· 白老师
· TEL:19522126617 (微信同号)
· QQ:2784981077
· E-mail:icmpes@sub-paper.com
Important Dates
Submission Deadline:2025-07-01
Registration Deadline:2025-07-08
Conference Date:2025-07-15
Notification Date:About a week after the submission
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